Technical Specifications Plates Matte black FR4 with gold edge-plating Matte black POM, CNC milled Hotswap PCB Kailh hotswap sockets ESD, over-voltage, and over-current protection USB-C Unified C3 daughterboard JST-SH cable (150 mm) QMK, VIA Configurator, and Remap compatible firmware FR4 Tg 170–180 ENIG surface finish Matte black solder mask 1.6 mm thick Solder PCB ESD, over-voltage, and over-current protection USB-C Unified C3 daughterboard JST-SH cable (150 mm) QMK, VIA Configurator, and Remap compatible firmware FR4 Tg 170–180 ENIG surface finish Matte black solder mask 1.6 mm thick ¹Split spacebar not supported by stock plates